This equipment interconnects the strings and prepares the wiring for the junction box. The machine also cuts and places the bussing ribbons under the strings ribbon/wires automatically.
Our systems offer high soldering precision and repeatability, obtained via the utilization of artificial vision systems and an induction soldering process, which also avoids the formation of hot spots. Starting from the interconnection ribbon spool the machine cuts and places the bussing ribbons under the strings ribbon/wires automatically. The string matrix is lifted up so no template is needed. Flux is applied to the interconnection ribbon.

Advantages:

– Interconnects the strings with no manual operation. High quality soldering.
– Reduces the number of operators in the line and increases the
– Accuracy of the interconnection position.
– Easy integration with MES systems. Totally suitable for:

1. Every type of wafer size: M3, M4, M6, M10, M12.
2. 5BB, 6BB, MBB and SWCT.
3. Full and half-cut cells module designs (Others to be discussed).